14 Layers Film Design LGA Fingerprint Sensor With Wafer Penetrability
Brief product introduction
The FL360 is the fingerprint sensor is based on capacitive-touched technology with a hardened surface and enhanced ESD strength. The built-in analog and digital circuits could minimize the number of external components, and provide easy-to-use standard SPI interface to microprocessors.
Applications
PC/Network Security Public Security Banking/Finance
Smartcard Application Telecommunication Health and Medical
Time and Attendance System POS/mPOS ATM/Kiosk
Specification
| Physical Parameter | | Capture Mode | Capacitive sensor | | Platen Size | 14.5*19.70 mm | | Sensing Area | 12.8*18.0mm | | Fingerprint Image Size | 256*360 pixels | | Image Resolution | 508 dpi | | Gray level | 256 level | | Communication Mode | | Communication Interface | SPI | | Operation environment | | Work Voltage | 3.3V | | Work Current | 50mA | | Temperature | -20℃-85℃ | | Humidity | 40%-80% R.H | | ESD | Contact: ± 8KV Air: ± 15KV | | Supported OS | | Windows XP / 7 / 8 / 10, Android, Linux, Embedded | | |
Product details
